LENANEO LA SEhlahisoa

Printed Circuit Boards (PCBs) ke mokokotlo oa lisebelisoa tsa sejoale-joale tsa elektroniki. Ba fana ka sethala sa hore likarolo tsa elektronike li hokahane le ho sebetsa hammoho. Ha e le hantle, PCB ke boto e bataletseng e entsoeng ka thepa e sireletsang, joaloka fiberglass, e nang le likarolo tse tšesaane tsa lipina tsa koporo tse tsamaisoang kapa tse hatisitsoeng holim'a boto. Litsela tsena tsa koporo li theha litsela tsa hore maqhubu a motlakase a phalle lipakeng tsa likarolo tse fapaneng joalo ka li-resistors, li-capacitor, li-circuits tse kopaneng, le tse ling.
Li-PCB li entsoe ka ho sebelisa software e thusang komporo (CAD), e behang likarolo le likhokahano tsa tsona. Hang ha moralo o se o lokile, ts'ebetso ea ho etsa PCB e qala. Sena se kenyelletsa mehato e mengata:
Tokiso ea Substrate: Lera le lesesaane la koporo le entsoe ka laminated holim'a thepa ea substrate (hangata fiberglass kapa lisebelisoa tse kopantsoeng).
Etching: Koporo e sa batleheng e tlosoa ka mokhoa oa lik'hemik'hale, e siea ka morao litselana tsa koporo tse entsoeng.
Ho phunya: Likoti tse nyane lia chekoa ho kenya likarolo tsa elektroniki le ho theha likhokahano tsa motlakase lipakeng tsa likarolo tse fapaneng tsa boto.
Ho beoa ha likarolo: Lisebelisoa tsa elektronike li rekisoa botong ho sebelisoa mochini o ikemetseng kapa ka letsoho.
Teko: Boto e kopaneng e etsa liteko ho netefatsa hore likhokahano tsohle li thehiloe hantle 'me ha ho na liphoso.
Semiconductor Plating DSA

Semiconductor Plating DSA

Lebitso la Sehlahisoa: Semiconductor Plating DSA
Kakaretso ea sehlahisoa: plating ea roll-to-roll, plating ea sesebelisoa sa ho ikopanya, ho roala foreimi ea lead, electropolishing, ho khetha sebaka, joalo-joalo.
Likarolo tsa sehlahisoa: E ka khethoa le ho etsoa ho latela litlhoko tsa hau. Sebopeho sa anode se ka etsoa ho latela litlhoko tsa bareki.
Lintlha-khōlō: bophelo bo bolelele, tšebeliso e tlaase ea matla, ho tšoana ho holimo ho holimo, litšenyehelo tse tlaase tsa tšebeliso, le ts'ebetso ea theko e phahameng.
Maemo a sebetsang: Ho roala ha karolo ea semiconductor: plating ea roll-to-roll, plating ea sesebelisoa sa ho ikopanya, ho roala foreimi ea lead, electropolishing, ho khetha sebaka, joalo-joalo.
Maemo a kopo: Electrolyte: acidic / cyanide system, gloss agent & li-additives tse ling PH: 4-5; mocheso 30 ℃-70 ℃;
Boima ba hona joale: 250-30000A / m2;
Mofuta oa ho roala: tšepe ea bohlokoa e kopantsoeng ea anode plating platinamo anode, botenya ba platinamo bo ka ba lum-10um, kapa botenya.
Sehlahisoa ka mor'a thekiso le tšebeletso: Re fana ka tlhahiso e ncha ea anode ka nako le ea boleng bo holimo le lits'ebeletso tsa khale tsa ho kopanya anode lefatšeng ka bophara.
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PCB Gold Plating DSA

PCB Gold Plating DSA

Lebitso la sehlahisoa: PCB Gold Plating
Kakaretso ea Sehlahisoa: Ntlafatsa conductivity, khanyetso ea oxidation, le ho se sebetse ha liboto tsa potoloho ho fihlela litlhoko tsa bona tsa ts'ebeliso liketsahalong tse ikhethileng.
Likarolo tsa sehlahisoa: ts'ebetso e ntle haholo, ts'ebetso e ntle ea electrocatalytic, matla a antioxidant, le botsitso.
Lintlha-khōlō: bophelo bo bolelele, tšebeliso e tlaase ea matla, ho tšoana ho holimo ho holimo, litšenyehelo tse tlaase tsa tšebeliso, le ts'ebetso ea theko e phahameng.
Maemo a sebetsang: board board ea khauta ea potoloho
Maemo a kopo: electrolyte acidic / cyanide system, gloss agent & li-additives tse ling Au: 4-10g / L, CN: khatello e tlaase, PH: 4-5; mocheso 40 ℃-60 ℃;
Boima ba hona joale: 0.1-1.0ASD; ka karolelano 0.2ASD
Sehlahisoa ka mor'a thekiso le tšebeletso: Re fana ka tlhahiso e ncha ea anode ka nako le ea boleng bo holimo le lits'ebeletso tsa khale tsa ho kopanya anode lefatšeng ka bophara.
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PCB VCP DC Copper Plating DSA

PCB VCP DC Copper Plating DSA

Lebitso la sehlahisoa: PCB VCP DC Copper Plating
Kakaretso ea Sehlahisoa: Lisebelisoa tsa ho roala tse sebelisoang lits'ebetsong tsa tlhahiso ea boto e hatisitsoeng (PCB).
Likarolo tsa sehlahisoa: litekanyo tse tsitsitseng, ho roala ka thata, ho hanyetsa kutu, bophelo bo bolelele ba tšebeletso;
ka katleho e fokotsa matla a tanka, phello e kholo ea ho boloka matla;
tšebeliso e tlase haholo e ka fokotsa litšenyehelo tsa tlhahiso.
Melemo le lintlha tsa bohlokoa: bophelo bo bolelele (bo ka etsoa ho latela litlhoko tsa bareki);
tšebeliso e tlase ea matla, le ts'ebetso e phahameng ea electrocatalytic.
Maemo a tšebeliso: electrolyte CuSO4 · 5H20 H2SO4; mocheso 20 ℃-45 ℃; segokanyipalo sa jwale 100-3000A/m2DC;
Maemo a sebetsang: Mohala oa VCP / mohala o otlolohileng oa koporo, ka / tlatsa / pulse koporo plating, bonolo / thata board plating, semiconductor substrate plating;
Ts'ebeletso ea kamora ho rekisa: Ho fana ka tlhahiso e ncha ea anode e nakong le ea boleng bo holimo le lits'ebeletso tsa khale tsa pente ea anode lefatšeng ka bophara.
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